Brief Biography

Dr. Bruce Kim received his Ph.D. degree in Electrical and Computer engineering from Georgia Institute of Technology, M.S. from the University of Arizona and B.S.E.E. degree from the University of California, Irvine. He lived in Tucson and worked at Hughes Aircraft Company in the 1980's. He also worked at Georgia Tech Research Institute on Radar Transmitters before starting his Ph.D. program. His current research interests are in design-for-testability for RFIC and SoC, high frequency device characterizations, VLSI circuits and CAD, MEMS, and System-in-Package. Some of his research projects have been supported by NSF CAREER, DARPA and microelectronics industry.  Dr. Kim is a senior member of IEEE and IMAPS.

Awards and Honors

  • IEEE Computer Society, Certificate of Appreciation, October 2007.
  • IEEE Computer Society, Certificate of Appreciation, October 2006.
  • United States Patent No. 7,129,719, October 2006.
  • Best Presentation Award, Andong National University, Korea, 2003
  • Outstanding Technical Contribution Award, IEEE Phoenix Section, 2003
  • IEEE MTT Society, ARFTAG Best Poster Paper, 2002.
  • IEEE Computer Society, Outstanding Contribution Award, October 2002.
  • IEEE MTT Society, Certificate of Appreciation, June 2002.
  • IEEE Phoenix Chapter, Special Chair Award, February 2002.
  • IEEE Computer Society, Meritorious Service Award, October 2001.
  • ASU Corporate Leaders Program, Professor of the Year Award, June 2001.
  • United States Patent No. 6,111,414, August 2000.
  • IEEE Computer Society, Certificate of Appreciation Award, October 1999.
  • IEEE Computer Society, Certificate of Appreciation Award, October 1999.
  • NSF/IEEE Education Award, Developing Educational Internet Modules, 1999.
  • IEEE & IMAPS, Best Paper Award, Multi-Chip Module Conference, April 1998.
  • NSF CAREER Award, Teaching and Research in Design Automation, July 1997.
  • IEEE ECTC, Best Paper Candidate, May 1996.
  • Marquis Who's Who in the South, 1995-1996.

Selected Recent Publications

  1. K. Lee, R. Liu, B. Kim, “Double Beam RF MEMS Switches for Wireless Applications,” Electronics Letters, Vol. 39, No. 6, 532-533, 2003.
  2. K. Lee, A. Singh, J. He, S. Massia, R. Clement, B. Kim, and G. Raupp, “Polyimide based neural implant with stiffness improvement”, Elsevier: Sensors and Actuators Part B, Vol. 102, No. 1, pp. 67-72, 2004.
  3. K. Lee, J. He, A. Singh, S. Massia, B. Kim, and G. Raupp, “Polyimide-based intracortical neural implant with improved structural stiffness”, Journal of Micromechics and Microengineering, Vol. 14, No. 1, pp. 32-37, 2004.
  4. K. Lee, J. He, R. Clement, S. Massia, and B. Kim, “Biocompatible Benzocyclobutene (BCB) based intracortical neural implant with microfluidic channel”, Elsevier: Biosensors and Bioelectronics, Vol. 20, No. 2, pp. 404-407, 2004.
  5. S.H. Lee and B.C. Kim, “Curled micro-cantilevers using benzocyclobutene polymer and Mo for wafer level probing,” Elsevier, Sensors and Actuators A, Volume121, Issue 2, pp. 472-479, 2005.
  6. Keekeun Lee and Bruce Kim, “MEMS spring probe for non-destructive wafer level chip test,” Journal of Micromechanics and Microengineering, Volume 15, pp. 953–957, 2005.
  7. J.Y. Ryu, B.C. Kim, “Low-Cost Testing of 5 GHz Low Noise Amplifiers Using New RF BIST Circuit,” Journal of Electronic Testing Theory and Applications (JETTA) , Volume 21, Number 6, pp. 571 – 581, December 2005.
  8. J.Y. Ryu, B.C. Kim, I. Sylla, “A Novel Low-Cost RF Built-In Self-Test Measurement for System-on-Chip Transceivers,” IEEE Transactions on Instrumentation and Measurement, Volume 55, Number 2, pp. 381 – 388, April 2006.
  9. J.H. Jang, N. Ishitobi, B.C. Kim, and S.G. Jeong, “Effects of Microstructural Defects in Multilayer LTCC Stripliine,” IEEE Transactions on Advanced Packaging, Volume, Number 2, pp. 314-319, May 2006.
  10. B.C. Kim, Y. Zorian, Guest Editor’s Special Issue, “Design and Test of System-in-Package,” IEEE Design and Test of Computers, May/June Issue 2006.
  11. J.Y. Ryu, B.C. Kim, I. Sylla, “A Novel RF Test Scheme Based on a DFT Method,” Journal of Electronic Testing Theory and Applications, Volume 22, Number 3, pp.229-237, June 2006.
  12. G. Kim, R. L. Martens, G. B. Thompson, B. C. Kim, and A. Gupta, “Selective area synthesis of magnesium oxide nanowires,” Journal of Applied Physics, 102, pp.104906-1 to 5, November 2007.
  13. H. Zhu, H. He, B.C. Kim, “Processing and Characterization of Dry-Etch Benzocyclobutene Dielectrics as Substrate and Packaging Material for Neural Sensors,” IEEE Transactions on Components and Packaging Technologies, Volume 30, Number 3, pp. 390-396, September 2007.
  14. S. Sundar, B. Kim, S. Wokhlu, E. Beskar,  R. Rousselin, T. Byrd, F. Toledo, D. Cotton, G. Kendall, “Low Cost Automatic Mixed-Signal Board Test Using IEEE 1149.4,” IEEE International Test Conference, Santa Clara, CA, October 2007.
  15. B. Kim, R. Kasim, “Advanced MEMS Development for High Power Sensor Application,” IEEE Sensors Conference, October, 2007.
  16. B. Kim, “Defect Modeling of CNT Interconnects for System-in-Package Applications,” Korea Test Conference, Seoul, Korea, June 29, 2007.
  17. B. Kim, “Diagnostic Program Generation Tool for ATE Load Boards,” Korea Test Conference, Seoul, Korea, June 29, 2007.
  18. Bruce C. Kim, Craig Force, "Guest Editors' Introduction: The Evolution of RFIC Design and Test," IEEE Design and Test of Computers, vol. 25, no.1, pp. 6-8, January-February, 2008.

Professional Society Contributions

  1. Session Chair, IEEE ECTC, Session 28, RF Modeling, May 2008.
  2. Guest Editor, IEEE Design and Test of Computers, Special Issue on RFIC Design and Testing, 2008.
  3. Guest Editor, IEEE Design and Test of Computers, Special Issue on Design and Test of SiP, 2007.
  4. Associate Editor, IEEE Design and Test of Computers, 2004 – present.
  5. Associate Editor, IEEE Trans. on Advanced Packaging, CPMT Society, 2004 – present.
  6. Editorial Board Member, Journal of Electronic Testing (JETTA), 2005 – present.
  7. Guest Editor, IEEE Trans. on Advanced Packaging, CPMT (Components, Packaging and Manufacturing Technology) Society, 2004.
  8. Editor-in-Chief, TTTC Newsletter, IEEE Computer Society, 2001 – present.
  9. Technical Committee Chair, TC-11, Electrical Test, IEEE CPMT Society, 2001 - present.
  10. Member Board of Governor, IEEE CPMT (Components, Packaging and Manufacturing Technology) Society, 2001-present.
  11. Editor-in-Chief, Embedded Newsletter in IEEE Design and Test of Computers, 2005 - present.
  12. Editor-in-Chief, Newsletter for JETTA, 2005 - present.
  13. General Co-Chair, Phoenix Section IEEE Workshop, “Devices, Interconnects, and Packaging for Next Generation Computing and Communication Applications,” 2003.
  14. General Co-Chair, Phoenix Section IEEE Workshop, “Devices and Packaging for Wireless Communications,” 2002.
  15. IEEE Chapter Chair, Phoenix IEEE Waves and Devices, 2000 – 2003.
  16. Chair, TTTC Awards Committee, IEEE Computer Society, 2000.
  17. Vice-Chair, TTTC Awards Committee, IEEE Computer Society, 1998 - 1999.
  18. Chair, IEEE CPMT Society TC-11, 2001-present.
  19. General Co-Chair, IEEE Workshop on Devices and Packaging for Wireless Communications, 2002.
  20. Chair, IEEE Phoenix Waves and Devices Chapter, 2001-2002.
  21. Chair, TTTC Awards Committee, IEEE Computer Society, 2000-2002.
  22. Vice-Chair, IEEE Phoenix Waves and Devices Chapter, 2000-2001.
  23. Vice-Chair, TTTC Awards Committee, IEEE Computer Society, 1998-1999.
  24. Executive Member, IEEE Phoenix Section, 2001-2002.
  25. Finance Co-Chair, IEEE MTT Society, International Microwave Symposium, 2001
  26. Chair, Local Arrangements, Midwest Symposium on Circuits and Systems, 2000.
  27. Session Chair, IEEE International Symposium on Circuits and Systems, 2002.
  28. Session Chair, IEEE International Test Conference, 1997, 2001.
  29. Session Chair, IEEE Electronic Components and Technology Conference, 2000, 2001.
  30. Session Chair, IEEE KGD Packaging and Test Workshop, 2001, 2002.
  31. Program Committee, IEEE Southwest Symposium on Mixed-Signal Design, 2003.
  32. Program Committee, IEEE Electronic Components & Technology Conference, 1998 - present.
  33. Program Committee, KGD Packaging and Test Workshop, 1997 - present.
  34. Program Committee, IEEE Asian Test Symposium, 2001 - 2003.
  35. Program Committee, IEEE North Atlantic Test Workshop, 1997, 2008.
  36. NSF Panel Reviewer, NSF CAREER, SBIR and Regular Programs, 1999, 2001, 2002, 2003, 2004, 2005, 2006, 2007, 2008.

Recent Invited Talks

  1. Army Center of Excellence for Aviation and Missile Technology (ARMDEC), “Novel IED Sensor Using MgO Nanowires,” Huntsville, Alabama, November 20, 2007.
  2. Auburn University, “CATGEN: Circuit Analyzer and Test Generator for Mixed-Signal Boards,” VLSI Design & Test Seminar, Electrical Engineering, ELEC7950, November 7, 2007.
  3. Samsung Techwin Ltd, “Trends of Nanowire Application in Industry,” Seoul Korea, July 2, 2007.
  4. Hanyang University, “Automatic Program Generation Tool for ATE Load Boards,” Korea, June 27, 2007.
  5. Alabama Department of Transportation, “Sensors for DOT Applications,” Montgomery, Alabama, June 8, 2007.
  6. Army Center of Excellence for Aviation and Missile Technology (ARMDEC), “UA Nanotechnology Research Activities and Plans,” Huntsville, Alabama, September 21, 2006.
  7. Samsung Techwin, “MEMS Breakers for Integrated Shipboard Power Systems,” July 20, 2006.
  8. Samsung Electronics, “Built-In Self-Test for RF System on Chip” July 20, 2006.
  9. IEEE Electronics Components & Technology Conference (ECTC) Half-Day Short Course, “Electrical Testing of High Density Package,” May 5, 2006.
  10. Auburn University, “Built-In Self-Test for Radio Frequency System-On-Chip”, VLSI Design & Test Seminar, Electrical Engineering, ELEC7950, March 1, 2006.
  11. UA MINT Seminar, “High Voltage MEMS Switch Arrays,” March 31, 2006.
  12. The University of Alabama, “Bio and Chemical Engineering Graduate Seminar/Design of Neural Probes,” Tuscaloosa, AL, March 24, 2005.
  13. Power Paragon, Inc. “MEMS Relay Arrays for High Power Distribution,” Anaheim, CA, July 15, 2004.

Professional Memberships

Senior Member, IEEE
Senior Member, IMAPS
Member, KSEA


University of Alabama
Department of Electrical & Computer Engineering
317 Houser Hall · Tuscaloosa, AL 35487
Phone: (205) 348-4972 · Fax: (205) 348-6959