Sensor Electronics Laboratory (SEL)

The mission of SEL is to provide training and education to undergraduate and graduate students in sensors and associated electronics. The laboratory has VLCT Automatic Test Equipment from Texas Instruments, Inc., Tektronix RF spectrum analyzer, Tektronix TDR and other major test equipment. The VLCT tester will perform automatic testing of a mixed-signal IC chips. We are proud to receive sponsorships for research projects from NSF, DARPA, Army, TI, SRC, Motorola, Philips, Samsung and L3 Power Paragon.

Current Projects

  1. Semiconductor Research Corporation (PI)
    "Title: Automatic Diagnostic Tool for AMS and RF Boards," Award period 8/1/2008 - 7/31/2011, Industry mentors: Dr. David Cotton, Sudhir Wokhlu, Craig Force, Dr. Friedrich Taenzler.
  2. National Science Foundation (PI) “CRI: Electronic Testing Education, Research and Training Infrastructure,” Collaboration with Auburn, Tuskegee, UAH Universities in total amount of $1M; Award Period 10/1/2007-9/30/2010, Award No. CNS-0708003.
  3. US Army Aviation and Missile Research (PI) “Synthesis of Nanowires for Sensor Applications,” Award Period 9/15/2007 – 9/30/2008.
  4. National Science Foundation (PI) “CPA: Testing of Nano-Interconnects in System-in-Package Substrates,” Award Period 5/1/2006-4/30/2009, Award No. CCF-0541200.

Past Sponsorships (PI or Co-PI for $9M)

  1. Sponsor: Semiconductor Research Corporation (2004-2007)
    Title: Automatic Diagnostic CAD Tool for Mixed Signal Load Board
  2. Sponsor: National Science Foundation (2002-2005)
    Title: Integrated MEMS and Advanced Technologies for the Next Generation Power Distribution System
  3. Sponsor: Motorola (2000-2003)
    Title: Modeling and Simulation of SAW Filters for Wireless Applications
  4. Sponsor: Texas Instruments, Inc. (Broadband Division) (2001-2003)
    Title: Development of Test Algorithms for Mixed-Signal DUT Board
  5. Sponsor: DARPA (DSO) (2000-2004)
    Title: Advanced Neural Implants and Control
  6. Sponsor: National Science Foundation (2001-2003)
    Title: Design of MEMS Probes for Testing Nano-Scale Interconnects
  7. Sponsor: National Science Foundation CAREER Award (1997-2001)
    Title: CAREER: Design and Testing of Integrated Passive Components and Interconnects in MCM Substrates
  8. Sponsor: National Science Foundation (NSF) and IEEE CPMT Society (1999-2000)
    Title: Internet Modules for Electronic Package Modeling and Simulation
  9. Sponsor: Motorola (SPS) (2000-2002)
    Title: Design of High Q RF Resonators for Wireless Applications
  10. Sponsor: National Science Foundation and IEEE (1998-2000)
    Title: Developing Multi-media Modules for Electronic Packaging Education
  11. Sponsor: National Science Foundation (1997-2000)
    Title: University Collaboration for Next Generation Packaging - Mixed Signal Test
  12. Sponsor: Philips Semiconductor (2000-2001)
    Title: Design of Low Power RF Receiver on SOI Substrate

Current Students

University of Alabama
Department of Electrical & Computer Engineering
317 Houser Hall · Tuscaloosa, AL 35487
Phone: (205) 348-4972 · Fax: (205) 348-6959